Highlights Page

Infinecs and UTP electronics innovation award event - Infinecs

Infinecs and UTP Unite to Advance Innovation in Electronics

On 18 July 2024, Infinecs Systems and Universiti Teknologi Petronas (UTP) signed a Memorandum of Understanding (MoU) to strengthen collaboration between academia and industry. This partnership marks an important step towards enhancing cooperation in areas of research, innovation, and talent development within the engineering and technology sectors.

Through this MoU, both parties aim to foster knowledge exchange, support industry-relevant research initiatives, and provide greater exposure for students to real-world applications. The collaboration reflects Infinecs Systems’ commitment to nurturing future talent and contributing to the advancement of Malaysia’s high-technology and semiconductor ecosystem.

Infinecs booth at DMF semiconductor showcase - Infinecs

SEMICON SEA 2026 MOF Visit

A meaningful throwback from SEMICON Southeast Asia 2026. We were honored to welcome Deputy Minister of Finance (MOF), YB Liew, to the Infinecs booth during the event.

MITI engagement at Infinecs SEMICON booth - Infinecs

MITI Engages Infinecs Booth

We are honored to receive a visit from the Minister of Investment, Trade and Industry (MITI) Dato Seri Johari Abdul Ghani, at the Infinecs booth, marking a meaningful moment of engagement during the event.

Infinecs and Penang delegation discuss semiconductor design innovation - Infinecs

Bridging policy and innovation

It was a privilege to welcome the Deputy Chief Minister II of Penang, YB Jagdeep Singh Deo, and his delegation at Infinecs Labs for a deep dive into the next generation of semiconductor design.